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2008 Edition of the chip semiconductor packaging industry in China, plastic materials research report excerpts


World Semiconductor chip package is divided into metal containers, glass containers, ceramic packaging and plastic packaging is currently more than 95% of semiconductor chips are plastic packaging, materials chips by the end use of plastic packaging, the appearance of difference can be divided into solid plastic mold epoxy (Epoxy Molding Compound, EMC, generally called the plastic materials used), or transfer molding, injection molding material, plastic liquid (liquid molding compound), the bottom of the adhesive filler (Underfill) three categories on a scale to the largest EMC in the solid state; EMC twentieth century, the fifties and sixties was born in the United States, ninety eight years to flourish in Japan, as China has rapidly emerged as the two major manufacturing country in the world, EMC, EMC manufacturing in China began in the twentieth century the eighties, is scheduled for 2007 EMC annual global demand of around 17 million tonnes, the demand for EMC in China about 45,000 tons in 2006 annual sales of EMC top three semiconductor manufacturers in the world Japan's Sumitomo Bakelite, Henkel Huawei Electronics Co., Ltd. (China), Japan's Nitto electrician; 2007 revenue package of chips in China, the two leading providers of EMC Henkel Huawei Electronics Co. Ltd. and Sumitomo Bakelite Co. , Ltd., Suzhou.

First, the basic situation of China's manufacturing EMC

EMC enterprises in China producing nearly 19 major companies are representative of Schedule 8, as well as Japan's Nitto Denko and other overseas manufacturers in China had reached Cake Factory built EMC.

At the end of 2006, Guangdong Yung Thai Industrial Co., Ltd. (Guangdong Yung-Tai 600 589) Board of Directors passed a resolution, decided to invest 108.85 million yuan in building green environmental protection type chips IC used in plastic packaging materials project, the project was originally scheduled for operational tests in 2007 but was postponed until the first half of 2008, production capacity planning project of 500 tons, plans for future expansion of 3,000 tonnes / year, will help improve China's product mix epoxy molding compound and the market structure, a listed company involved in the chip industry, plastics, which greatly benefit plastics to improve the chip industry in the public awareness and recognition to promote the industry of brand building. Other private first class to reach the plastic, mainly low-level redundant construction, China plastic hardware chip low-end apparent excess production capacity, price competition more heated.

Henkel Huawei Electronics Co., Ltd. joint venture after new chip, the molding facilities in October 2007 in Lianyungang, a formal operation, which makes Henkel Huawei Electronics molding compound annual total production capacity of 3.6 million tonnes, is the world's largest single ring oxygen plastics factory.

Looking for the end of 2007, mainland China EMC combined total capacity of nearly 80,000 tons, Henkel Huawei Electronics Co., Ltd., Sumitomo Bakelite Suzhou Co., Ltd., Changchun Feng Plastics (Changshu) Co., Ltd. Changxing Electronic Materials (Kunshan) Co., Ltd., Hitachi Chemical Industry (Suzhou) Co., Ltd., a total of 5 62 000 tonnes, or 78.5% of total capacity, other manufacturers' production capacity of 18,000 tons or 22 , 5% of total capacity. EMC is expected by the end of 2008 China's total capacity to more than 80,000 tons.

2007 package with the EMC in China about 44,000 tons with a total of mainland China makers about Qi Cheng, imports from overseas in the EMC about three years the growth rate of about 15% .

China EMC characteristics of the geographical distribution of Manu.